Alumina Ceramic Ball Valves Dye Penetrant Test

In the Innovacera each ceramic ball valves production, after product finish producing, Innovacera arranges to put the alumina ceramic ball valves in the dye penetrant to test any cracked inside of the product and make sure every ball valves quality is qualified.

After confirming the dye penetrant test is qualified, then Innovacera arranges to clean the ceramic ball valves.

ALN – An Insulation High Thermal Conductivity Material

Aluminum Nitride is one of the function ceramics among all the advanced ceramics. It has very good thermal-mechanical and electrical properties: high thermal conductivity, low dielectric constant, the linear expansion coefficient matches well with silicon, good electrical insulation, low density, non-toxic, high mechanical strength, and so on. with the fast development of microelectronics, the high T/C AIN used as the base or package material has been put on more and more focus.

With the development of the electric components, smaller but better performance and lower energy cost elements are of pressing demand. The high dense, high power, and high frequency component may generate as much as 100W/cm² heat, such as High bright LED, MOSFET, IGBT, and laser elements. The longer those elements work, the more heat accumulated. Due to the limited room in the package, if the heat could not have been diffused in time, it would highly affect the elements’ life, performance, and reliability. So, it is important to introduce a good cooling package design and high thermal conductivity ceramic materials into these industries.

Innovacera has 4 main products: AlN substrate, AlN Structural parts, AlN dry pressed tablets, Isostatic pressed parts, and so on.

If you have more interest, please feel free to contact us.

Below is our Regular Dimensions of AlN Substrate / Wafer:

Thickness (mm)	Length*Width (mm)
0.385	2″*2″ 50.8*50.8mm		3″*3″ 76.2*76.2mm		4″*4″ 101.6*101.6mm		4.5″*4.5″ 114.3*114.3mm
0.5
0.635
1.0
	Diameter (mm)
1.0	Φ16 Φ19	Φ20 Φ26	Φ30 Φ35	Φ40 Φ45	Φ50 Φ52	Φ60	Φ75	Φ80
1.2
1.5
2.0
2.5
PS: Other dimensions which are not listed are available upon your requests.

Laser pumping cavity ceramic reflector

Introduction to ceramic reflector
The material of the ceramic reflector is 99% Al2O3. Its green body is fired at a suitable temperature to retain the proper porosity and strength. The surface of the ceramic reflector is coated with a high reflectivity ceramic glaze, so compared with the gold-plated reflector, it has long service life and diffuse reflection.

Production Process

• Preparation of the green body
• Preparation of glaze slurry: raw material weighing – grinding – screening
• Glazing: glazing by spraying
• Glaze burning: the glazed product is burning at a high temperature
• Inspection: Appearance inspection, dimensional measurement, and reflectance measurement
• Packaging

Prime Features

• Surfaces can be sealed and coated with a solarization-resistant glaze to give high bulk reflectivity
• 97% reflectance efficiency at 600-1000nm
• Reflectance efficiency exceeds 95% across the wavelength range 400-1200nm (see curve)
• Controlled porosity
• Good thermal conductivity
• High electrical resistivity

Precautions for the use of ceramic reflectors

• In the process of transportation, storage and assembly, it is prohibited from serious external damage, such as falling off to the ground and the size is not suitable for forced pressing into the shell
• The semi-glazed ceramic reflector must be sealed with the shell to prevent it from inhaling a large amount of coolant, resulting in a decrease in power
• During assembly and maintenance, it is forbidden to scratch the reflective surface of the ceramic to decreasing the reflectivity
• In the short-wavelength (eg 755nm) high-temperature systems, it is important to pay attention to the choice of cooling system piping and equipment materials for avoiding free metal oxides contaminating the ceramic surface

Silicon Nitride Ceramic Substrate for Electronics

INNOVACERA Silicon Nitride substrates, with a thermal conductivity rating of 90 Watts/meter Kelvin, at first glance, appear inferior to Aluminum Nitride grades from the standpoint of heat dissipation. However, Silicon Nitride substrates, due to their far superior mechanical properties, can provide thermal resistance levels comparable to Aluminum Nitride.

This is because Silicon Nitride substrates have twice the strength and fracture toughness of Aluminum Nitride substrates, which enable the circuit/package designer to use Silicon Nitride substrates that can be half as thick as Aluminum Nitride substrates.

These same impressive mechanical properties also make Silicon Nitride substrates an excellent choice in applications where severe, repetitive thermal cycling of the circuit/package is present.