Application of aluminum nitride substrate

Aluminum nitride products are attracting more and more attention as a new generation of high thermal conductivity materials due to their superior thermal conductivity, high insulation, and thermal expansion rate close to silicon.

Aluminum Nitride Substrate

Features:

  1. High thermal conductivity: about 7 times the thermal conductivity of alumina
  2. Thermal expansion rate: thermal expansion is close to silicon, and the reliability of the mounting of large silicon wafers and heat-resistant cycles
  3. Electrical characteristics: high insulation, low dielectric coefficient
  4. Mechanical properties: superior to the mechanical properties of alumina
  5. Corrosion resistance: stronger than molten metal corrosion resistance
  6. Purity: low impurity content, non-toxic, high purity

Application:

  • High-power transistor module substrate
  • High-frequency device substrate
  • Heat-radiating insulation board for turn module
  • Fixed substrate for semiconductor laser and light-emitting diode
  • Hybrid integrated module, the ignition device module
  • IC package
  • Thermal module substrate
  • Some products for semiconductor production equipment

New Inorganic Material – Aluminum nitride (AlN) ceramics

The main crystal phase of aluminium nitride ceramics is aluminium nitride powder, which has the following characteristics:

Aluminum Nitride Ceramic Characteristics

1. What is aluminum nitride?

  • Aluminium Nitride (AIN) is one kind has the six-party wurtzite structure form of refractory compounds
  • The colour is grey
  • Aluminium nitride crystals are covalently bonded compounds with Warzite structure based on [AIN4] tetrahedral structure
  • The density of 3.26 g/cm3
  • Lattice constant a = 3.11, c = 4.980
  • The decomposition temperature is 2480℃ under normal pressure

Aluminum Nitride Ceramic

Advantages of aluminum nitride ceramic materials:

  • The strength of room temperature is high and decreases slowly with the increase of temperature
  • It has a high thermal conductivity
  • Low dielectric constant and dielectric loss
  • Low coefficient of thermal expansion
  • Good chemical stability and non-toxic

Aluminum Nitride Ceramics

2. Preparation of aluminium nitride powder

The excellent properties of Aluminum nitride ceramics are based on the high quality of their powders. There are many methods to prepare aluminium nitrite powder, such as direct nitridation, carbide reduction process, energetic ball milling, Self-propagating high-temperature synthesis, in situ autoreactive syntheses, plasma chemical synthesis, chemical vapour deposition method, solvothermal method and organic salt cracking.

3. Forming process of Aluminum nitride ceramic

Aluminium nitride ceramic formin process mainly includes: dry forming and wet forming.
1) Dry Formingis suitable for products with simple shapes and high cost, including the following two moulding methods:

  • Ordinary die forming
  • Cold isostatic forming

2) Wet Formingis suitable for products with complex shapes, low cost and simple process, mainly including the following moulding methods:

  • Tape casting
  • slip casting
  • Injection moulding
  • gel casting

Sintering method of aluminum nitride ceramics

  • Add sintering assistant
  • Spark Plasma Sintering (SPS)
  • Microwave Sintering
  • Pressureless singtering

4. Applications of aluminum nitride ceramics
1) Based on higher volume resistivity, insulation strength, thermal conductivity, lower thermal expansion coefficient and dielectric constant, it can be used for Insulation substrates for high-power semiconductor devices, heat dissipation substrates for large-scale and VLSI circuits, and packaging substrates.

Aluminum Nitride Ceramic Substrates

2) Based on high acoustic conduction velocity characteristics, can be used in Surface wave device in a high-frequency information processor.

Surface wave device

3) Based on high fire resistance and high temperature and chemical stability, can be used to make work under 1300 ~ 2000 ℃ of the crucible

crucible

The research of aluminium ammonite ceramics is still in the progress. If the synthesis cost of high-quality powders can be greatly reduced, the densification sintering at low temperature can be realized, and high-quality fluidized substrates can be obtained stably, it will be more and more widely used in the microelectronics industry and other high-tech fields.
INNOVACERA engages in R&D, manufacturing and selling the products of advanced ceramic materials, including Aluminum Nitride, Alumina, Zirconia, Boron Nitride, Silicon Nitride, Machinable Glass Ceramic, and other advanced materials. Through different manufacturing processes, we supply metallized ceramic components, alumina heater, ceramic pump components, and other ceramic components as request.

To find out more about aluminium nitride or any of our other products or services, please feel free to contact us today.
sales@innovacera.com http://www.innovacera.com

Q&A about aluminum nitride

1. Different applications in general
* High brightness high power LED
* Microwave wireless communication and semiconductor equipment
* Automobile
* Energy
* IGBT Module
* IPM Module
Different applications in general

2. Do you have some references for the different applications?
We don’t have detailed information.
With the development of the electric components, smaller but better performance and lower energy cost elements are pressing demand. The high dense, high power and a high-frequency component may generate as much as 100W/cm2 heat, such as high bright LED, MOSFET, IGBT and laser elements. The longer those elements work, the more heat accumulated. Due to the limited room in the package, if the heat could not have been diffused in time, it would highly affect the elements’life, performance and reliability. So, it is important to introduce good cooling package design and high thermal conductivity ceramic materials into these industries.

3.Can supply pictures of some products in the application?
* IGBT Module
IGBT Module

* High brightness high power LED
Automobile headlights; Industrial lighting; deep UV lamp; LCD background light source; Indoor agricultural lighting.

High brightness high power LED

* Components for semiconductor equipment
Components for semiconductor equipment

4. Do you have some standard dimensions or similar product descriptions?
* ALN substrate is available in regular sizes

Substrate shape Size Range Thickness
Square ≤114mm 0.17-2mm
Round ≤Dia120mm 0.25-2mm

ALN substrate are available in regular sizes

* ALN metallized HTCC products
ALN Metallized HTCC(High temperature co-fired ceramic) is a kind of high thermal conductivity and high-density ceramic substrate/package made with the designed circuit in/ on it. The circuit is tungsten metal and the insulating base is ALN ceramic. The process including via punching, via filing, circuit printing, isostatic laminating, high-temperature sintering and so on. Aluminium nitride HTCC technology is suitable for high-density packaging modules and components. It is of great significance to reduce the size and weight of modules and improve the integration of modules. It adapts to the requirements of the military, electronic, aerospace, missile and other military electronic equipment in miniaturization, high performance, multi-function, high reliability and low cost

ALN metallized HTCC products

* AlN structural parts/ Dry pressed tablets
We can provide AlN parts according to the customer’s design to meet different application demands.
AlN structural parts

5. Have you already supplied this material to Europe / Germany?
Yes. Like Britain, Germany, Italy

Ceramic Pump Sanitizer Safety Instructions

ceramic metering pump

Here are the Safety instructions of the ceramic metering pump for dosing disinfectant and sanitizer in the filling machine.

  • The ceramic pump can use hot water, soapy water, alcohol, or other cleaning liquid to clean the internal remnants several times through the reciprocating work of the machine until no residue of the material comes out, then rinse with clean water. Or disassemble it for disinfection.
  • When cleaning the internal parts, do not touch the surface of the parts with sharp tools. After cleaning, wait until the parts are dry before installing.
  • Check if the sealing ring of each part is damaged, if any, replace the new sealing ring;
  • Check if the screws in each part are loose, if any, re-lock.
  • Do not flush the motor with cleaning fluid to prevent damage to the components.
  • Try to avoid being in a state of no material for a long time when using it.
  • It is strictly forbidden to enter hard parts or particles other than materials into the pump head assembly.
  • For perfusion of volatile liquids, please use them in a circulating air environment.
  • When the machine is working, it is strictly forbidden that any part of the body or other items are close to the moving parts of the machine. The factory is not responsible for the mechanical damage and personal injury caused by the machine.
  • The equipment must be disconnected from the power supply when replacing components.
  • It is strictly forbidden to use organic flux to clean the machine, such as gasoline, benzene, xylene, banana water, sodium hypochlorite, etc.
  • When the machine is shut down, turn off the power switch, unplug the power cord, and clean up the miscellaneous items.